AMB substrate
High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.
The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) Aluminum nitride (AlN) Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.
- Company：アイン 本社工場
- Price：Other
